发明名称 |
STORAGE DEVICE AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a storage device capable of efficiently dissipating the heat of circuit component so as to enhance the heat dissipation effect of the circuit component. SOLUTION: The storage device has a printed circuit board 17 supported by a chassis 15. The printed circuit board mounts an LSI package 24 on itself that generates heat and is covered with an insulation sheet 32. The insulation sheet 32 has an opening 34 at a position opposed to the LSI package. A heat conduction sheet 33 is stacked on the insulation sheet. The heat conduction sheet covers the opening from a side opposite to the printed circuit board and is thermally connected to the LSI package through the opening. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004030837(A) |
申请公布日期 |
2004.01.29 |
申请号 |
JP20020188446 |
申请日期 |
2002.06.27 |
申请人 |
TOSHIBA CORP |
发明人 |
OOKA SATOSHI;KUBOTA TOSHIHARU |
分类号 |
G11B25/04;G11B33/12;G11B33/14;H05K7/20;(IPC1-7):G11B33/12 |
主分类号 |
G11B25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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