METHOD OF POLISHING A SUBSTRATE WITH A POLISHING SYSTEM CONTAINING CONDUCTING POLYMER

摘要

The invention provides a method of polishing a substrate comprising (i) contacting a substrate with a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of 10<-10> S/cm to 10<6> S/cm, and (c) a liquid carrier, and (ï) abrading or removing at least a portion of the substrate to polish the substrate.