Electronic module with integrated circuit, has substrate conductor paths electrically connecting integrated circuit with power component

摘要

An electronic module (1) has a ceramic plate (50) with conductor paths (40-44), in which the conductor paths have a layer thickness of more than 100 mu m , and on the ceramic plate (50) is arranged at least one integrated circuit (30), at least one power component (100) and a connection substrate (20). The connection substrate has at least on one side conduction paths (70) of a thickness exceeding 100 mu m, and the conductor paths (70) electrically connect the integrated circuit (100) with the power component (100), and the conductor paths (40-44) of the ceramic plate (50) are connected via solder points (80) with the integrated circuit (30), the power component (100) and with the conductor paths (70) of the connection substrate (20). An independent claim is included for a method of manufacturing an electronic module.