发明名称 Substrates component equipping device with revolving equipping head, has pickoff plane and substrate plane arranged obliquely relative to one another
摘要 <p>A device for equipping substrates (2) with components (3) in which linearly adjacent pick-off sites from the supply devices (5) of the components are provided in a pickoff plane. Equipping head (7) is moveable relative to the pickoff sites (4) and the latter and a substrate plane are arranged obliquely to one another. The intersection line between these planes extends parallel to a row of pickoff sites. The revolving turret-shaped equipping head has a step-wise rotatable rotor (11) with grippers (12). The supply/feed devices (5) are fixed in position and the equipping head travels in a fixed longitudinal guide (6) parallel to the row of pickoff sites and the substrate travels in a fixed transverse guide (9) transversely to the longitudinal guide (6).</p>
申请公布号 DE10230901(A1) 申请公布日期 2004.01.29
申请号 DE2002130901 申请日期 2002.07.09
申请人 SIEMENS AG 发明人 BURGER, STEFAN;MEHDIANPOUR, MOHAMMAD
分类号 H05K13/04;(IPC1-7):H05K13/02 主分类号 H05K13/04
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