WOUND WIRE DEVICE, MANUFACTURING METHOD FOR WOUND WIRE DEVICE, AND BALLAST CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a wound wire device in which temperature rise in the wound wire is suppressed.

SOLUTION: The wound wire device includes : cores 3 and 4 ; wire windings 2 which are installed in the cores 3 and 4; and thermoconductive material 6. The thermoconductive material 6 is set around external surfaces of the wire windings 2 in such a way that the wire windings 2 contact with the cores 3 and 4 via the thermoconductive material 6.

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