发明名称 METHOD AND DEVICE FOR ARRANGING AND MOUNTING CONDUCTIVE BALL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method and a device for arranging and mounting conductive ball by which conductive balls can be arranged efficiently without causing defective suction. <P>SOLUTION: After the conductive balls B contained in a container 14 are arranged on an array board 19 by suction, the balls B are collectively mounted on an electrode to be mounted with the balls B. The suction and arrangement of the balls B are performed only in the portion of the arranging surface facing the container 14 while the container 14 and the array board 19 are parallelly moved with respect to the arranging surface. The area of the ball supplying area of the container 14 is smaller than the arranging area of the array board 19. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004031584(A) 申请公布日期 2004.01.29
申请号 JP20020184814 申请日期 2002.06.25
申请人 NIPPON STEEL CORP;SHIBUYA KOGYO CO LTD 发明人 HASHINO HIDEJI;TATSUMI KOHEI;NIITSUMA KAZUO;IWATA MAKOTO
分类号 H05K3/34;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K3/34
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