发明名称 METHOD FOR PRODUCING MOUNT FOR WIRING TEST AND MOUNT THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a method for producing an acquisition type mount for wiring test having a probe plate (or upper side plate) separated from an interface plate (or downside plate). SOLUTION: In the method for wiring to the mount for test equipped with two parallel mount plates (14, 16), a wire is allowed to be directly threaded into a hole of a place to be wired by using a system of a software algorithm for controlling the movement of one plate to the other plate and a positioning device (26, 28). Meanwhile, a wire is randomly wired from a place on the plate to a place on the second plate by allowing the place, which are already threaded and arranged, to slide inside the holes of the mount plate and reach a following hole counter place. After the mount is wired, a terminal (46) is added to a wire end appearing from the hole of the mount plate. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004029024(A) 申请公布日期 2004.01.29
申请号 JP20030179972 申请日期 2003.06.24
申请人 DELAWARE CAPITAL FORMATION INC 发明人 MICZEK GREGORY;NEWHALL THOMAS;ONGE GARY ST;ROGERS DAVID P
分类号 G01R1/06;G01R1/073;G01R31/28;(IPC1-7):G01R31/28 主分类号 G01R1/06
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