摘要 |
PROBLEM TO BE SOLVED: To pick up chips excellently one by one on a tape regardless sizes thereof. SOLUTION: A push pin 5 is raised with a lift 6 and is controlled to move upward passing through an adhesive tape 22. The push pin 5 pushes upward almost the center position of the chip 21 so that it is removed from the adhesive tape 22. Simultaneously, while the chip 21 is sucked to a sucking recess 8a of an sucking head 8, the chip 21 is picked up with the sucking head 8 while a lift rod 9 of a pickup unit 3 is raised. In this case, since the other chips 21 adjacent to the chip 21 described above is clamped with lower end of a clamping portion 11, the other chips 21 are never removed from the adhesive tape 22, the adhesive tape 22 is never raised at the portion of the other chips 21, the other chips 21 are never inclined to be in the contact condition, and the chips on the adhesive tape 22 is freed from damage. COPYRIGHT: (C)2004,JPO |