发明名称 DIE EJECTOR APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a die ejector apparatus having an overrun preventing mechanism which can prevent surely by a simple mechanism a pepper-pot from moving erroneously to the outside of a chip distributing area present on a wafer sheet. SOLUTION: In the die ejector apparatus, a thrusting-up unit 1 having a pepper-pot 3 moves in an X-direction along an X-table 11, and moves in a Y-direction along a Y-table 12. The sliders of the ends of rods 21, 22 stuck on an axis portion 20 slide respectively along a linear guide 17 present under the X-table 11. Dogs 25, 26 are provided respectively in the ends of the rods 21, 22, and a sensing portion 8 for the dogs 25, 26 is provided in the thrusting-up unit 1. When the sensing portion 8 senses the dogs 25, 26, the thrusting-up unit 1 so stops its movements in the X- and Y-directions as to prevent the pepper-pot 3 from overrunning to the outside of the chip distributing area present on the wafer sheet. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004031722(A) 申请公布日期 2004.01.29
申请号 JP20020187200 申请日期 2002.06.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIRAKAWA TOSHIRO
分类号 H01L21/67;H01L21/50;H01L21/52;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/67
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