发明名称 FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a two-layer flexible printed wiring board having high durability over a high temperature long period and high temperature and high humidity and having a metal conductor with high adhesion strength even when heat or stress is applied thereto. SOLUTION: The flexible printed wiring board is provided with metal deposition layers 2, 3 and 4 on one face or both the faces of a plastic film 1, and laminates a conductive metal layer 5 on the metal deposition layers. The flexible printed wiring board comprises a structure laminating at least three layers of a layer 2 mainly comprising Ni and Cr, a layer 3 mainly comprising Ni and Cu and a layer 4 mainly comprising Cu. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004031588(A) 申请公布日期 2004.01.29
申请号 JP20020184940 申请日期 2002.06.25
申请人 TOYO METALLIZING CO LTD 发明人 AMIOKA TAKAO;MIYAKE TORU;NAKANO AKINORI
分类号 H05K1/09;B32B15/08;H05K1/03;H05K3/24;(IPC1-7):H05K1/09 主分类号 H05K1/09
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