发明名称 |
ADAPTIVE ELECTROPOLISHING USING THICKNESS MEASUREMENTS AND REMOVAL OF BARRIER AND SACRIFICIAL LAYERS |
摘要 |
A metal layer formed on a semiconductor wafer is adaptively electropolished. A portion of the metal layer is electropolished, where portions of the metal layer are electropolished separately. Before electropolishing the portion, a thickness measurement of the portion of the metal layer to be electropolishe d is determined. The amount that the portion is to be electropolished is adjusted based on the thickness measurement. A metal layer formed on a semiconductor wafer is polished, where the metal layer is formed on a barrie r layer, which is formed on a dielectric layer having a recessed area and a no n- recessed area, and where the metal layer covers the recessed area and the no n- recessed areas of the dielectric layer. The metal layer is polished to remov e the metal layer covering the non-recessed area. The metal layer in the recessed area is polished to a height below the non-recessed area, where the height is equal to or greater than a thickness of the barrier layer.
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申请公布号 |
CA2491951(A1) |
申请公布日期 |
2004.01.29 |
申请号 |
CA20032491951 |
申请日期 |
2003.07.22 |
申请人 |
ACM RESEARCH, INC. |
发明人 |
YIH, PEIHAUR;KOEHLER, DAMON L.;YU, CHAW-CHI;AFNAN, MUHAMMED;WANG, HUI |
分类号 |
B23H5/08;C25F3/02;C25F7/00;H01L21/302;H01L21/321;H01L21/3213;H01L21/461;H01L21/768;(IPC1-7):H01L21/306 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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