| 摘要 |
An inexpensively fabricated area array semiconductor device substrate having patterned metal interconnections on one surface of a flexible tape 501 is slit in non-patterned regions of each quadrant, and folded so that chip contact pads 507 are located on the top of the substrate, the leads wrap around the edges, and external solder ball contact pads are on the opposite surface of the substrate, thereby eliminating the need for conductive vias. A chip 503 is connected to the substrate either by conventional wire bonding 510, or by flip chip interconnection. In different embodiments, heat spreaders or other rigid core materials are incorporated, as well as various configurations of stress absorbing layers which assure reliable device assembly. <IMAGE> |
