Wafer surface cleaning apparatus and method

摘要

A substrate cleaning assembly (10) and method for removing contaminant substances (11) from a surface (12) of a substrate (13) employed in microelectronics manufacturing. The cleaning assembly (10) includes a substance locator (15) adapted to locate and map at least one contaminant substance (11) on the surface (12) of the substrate (13) and a dispenser (16) formed and dimensioned to accurately dispense a substantially controlled, impinging stream (17) of cleaning agent along a path (18). A controller (20) is coupled to the map device (15) and the dispenser (16), and is adapted to control the impinging stream (17) such that the located contaminant substance (11) is positioned in the path (18) of the impinging stream (17) to enable substantially localized impingement and removal of the substance (11) from the substrate surface (12).