| 摘要 |
PURPOSE: A copper paste and a wiring board using the same are provided to ensure good plating or soldering property of a conductor layer, no generation of bulging or separation of the conductor layer even when the wiring board is heated. CONSTITUTION: A wiring board(1) comprises a conductor layer(10,11) comprising Fe and Cu, and at least one of a radiator(3), a connection terminal(6), a cover(7) and a circuit component, connected to the conductor layer(10,11) through a joining member. A surface of the conductor layer(10,11) is subjected to a plating treatment. |
