| 摘要 |
PURPOSE: A semiconductor manufacturing equipment having an improved gas jet apparatus is provided to be capable of improving the uniformity of a layer by improving the structure of a gas supply path of a nozzle plate. CONSTITUTION: A semiconductor manufacturing equipment is provided with a susceptor for supporting a wafer by using suction and a gas jet apparatus(100) installed at the lower portion of the susceptor. The gas jet apparatus includes a plurality of nozzle plates(110,130) for jetting process gas upward. At this time, the first and second gas storing groove(111,111',113,113') formed at the predetermined portions of the nozzle plates. At the time, the first and second gas storing groove are connected with each other through a plurality of connection paths(115,115'). Preferably, the connection paths become smaller and smaller from the center portion of the nozzle plate to the both sides.
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