ONE-PACKAGE BOTTOM-CHIP MOUNT TYPE CRYSTAL OSCILLATOR AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: An one-package bottom-chip mount type crystal oscillator and a method for manufacturing the same are provided to make the crystal oscillator compact by saving the manufacturing cost and by reducing the height of the products. CONSTITUTION: An one-package bottom-chip mount type crystal oscillator includes a crystal unit(5), a chip and a base. The crystal unit(5) is provided with a manufacturer's pad and a user's pad. A crystal blank(3) is installed inside space of the crystal unit(5). A lead(4) is installed on the top side of open unit. The chip is electrically circulated with the crystal unit(5) and the crystal blank(3) at the bottom surface. And, the base is provided with a user's pad and a chip insertion hole. The base is attached to the bottom surface of the crystal unit(5) by inserting the chip into the chip insertion hole.