COPPER PASTE, WIRING BOARD USING THE SAME, AND PRODUCTION METHOD OF WIRING BOARD

摘要

PURPOSE: A copper paste, a wiring board using the same, and a production method of wiring board are provided to form a high-frequency circuit and reduce transmission loss and high-density packaging by coating and firing a copper paste on a ceramic green sheet. CONSTITUTION: A wiring board is formed by coating a copper paste on a ceramic green sheet and firing it to form a conductor layer and an insulating layer. The copper paste includes a copper powder, an organic vehicle, and at least one selected from the group consisting of an SiO2 particle having an average particle size of 50 nm or less and a ceramic particle having an average particle size of 100 nm or less and non-vitrifiable after sintering.