发明名称 |
Semiconductor chip having a supporting member, tape substrate, semiconductor package having the semiconductor chip and the tape substrate |
摘要 |
A semiconductor chip includes a substrate having a main surface, the main surface including a flame-shaped first area, which is along sides of the main surface, and a second area encompassed by the first area, a pad formed in the first area and a bump electrode formed on the pad, and at least one supporting member formed in the second area.
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申请公布号 |
US6683369(B2) |
申请公布日期 |
2004.01.27 |
申请号 |
US20020197529 |
申请日期 |
2002.07.18 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
IWAMOTO NAOFUMI |
分类号 |
H01L21/56;H01L21/60;H01L23/16;H01L23/498;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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