Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby

摘要

A method of obtaining a module (4), and the module obtained, from modular electronic components encapsulated in flat monoblock packages (1A) in which elements constituting the components are buried and from which project laterally conductive connecting leads (3A), the packages being stacked and buried in an insulative block corresponding to at least one module and the projecting connecting leads of the stacked packages being flush with a surface of the block, on at least one face of said block on which are formed conductive interconnection tracks and/or contacts for connecting the leads with connecting means external to the module. The method includes, before stacking the packages, an operation of modifying the connecting leads of the packages in order to reduce their overall size and an operation of reducing the height of the packages by thinning their respective bases.