| 摘要 |
A shield cap and a semiconductor package including a shield cap provide protection for passive components mounted on a substrate of a semiconductor package. The shield cap provides a means for manufacturing a semiconductor package that includes a semiconductor die and passive components without encapsulating the passive components within the encapsulation protecting the semiconductor die. The shield cap provides electromagnetic shielding and physical protection for the passive components and may provide thermal conduction from a semiconductor die by contacting the semiconductor die. The shield cap may be perforated to permit air circulation through the shield cap for providing improved thermal performance or may be a solid metal shield, providing improved electromagnetic shielding.
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