Method of forming shallow trench isolation and method of manufacturing a semiconductor device using the same

摘要

A method of forming a shallow trench isolation of a semiconductor device, includes providing a semiconductor substrate including field and active regions; forming a first insulating layer and a mask layer on the active region that expose the field region; etching the exposed field region to form a shallow trench; etching a portion of the mask layer to recess the mask layer a predetermined distance from an edge of the trench; forming a second insulating layer in the trench, the second insulating layer having a step higher than the active region; forming a liner layer as covering the mask layer and the second insulating layer; forming a third insulating layer as covering the liner layer and filling the trench; etching the mask, liner and third insulating layers to provide a planarized surface; removing the remaining mask layer; and removing the remaining first insulating layer.