| 摘要 |
A tip of a soldering iron is provided which separates any solder bridge, sucks up excess solder, and performs normal soldering operation. The tip has a cutter blade-like portion with its edge inclined. Grooves are formed on both side surfaces of the cutter blade-like portion. Solder guides extend along the grooves, and cylindrical through-holes penetrating the tip are formed at the ends of the grooves closer to an iron handle. When the cutter blade-like portion is applied to a solder bridge, solder is melted, and sucked up from the solder guides through the grooves by capillary action. Excess melted solder is collected to be stored by its surface tension.
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