| 摘要 |
A method for controlling a polishing characteristic of a polishing pad used in the planarization of a substrate is disclosed. The method includes controlling the temperature of a planarizing surface of the polishing pad so that waste matter accumulations on the planarizing surface are softened and/or be come soluble. The planarizing surface is heated by directing a flow of heated planarizing liquid or a heated gas onto the surface so that the material comprising the planarization surface attains approximately its glass transition temperature. Alternatively, the planarizing surface may be heated by heating a support surface beneath the polishing pad or by heating the air proximate to the polishing pad.
|
