| 摘要 |
A device for aligning a flatted object to a desired orientation. The flatted object has a substantially circular perimeter and a flatted chord portion and may be a silicon wafer or a cover for an electrostatic chuck. The device includes multiple conically shaped rollers that center and rotationally align the object, each roller having a bottom lip for supporting the object. Centering rollers are mounted so that they contact the circular perimeter of the object when it is in the desired orientation. Rotational alignment rollers are mounted so that they contact the flatted chord portion of the object when it is in the desired orientation. When placed on the alignment device, the flatted object passively moves to the desired orientation under the force of gravity.
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