| 摘要 |
PURPOSE: A method for fabricating an FA module is provided to perform a signal analysis for a desired part by forming an under-metal line on an inter-metal oxide layer, forming a top metal line, and etching an FA module to expose an FA via. CONSTITUTION: An under-metal line(22) is formed by depositing a metal material on an inter-metal oxide layer(20) and performing an etch process. The first photoresist layer(24) is stacked on the inter-metal oxide layer(20). A pattern is formed by performing an exposure process. A via hole is formed by performing the etch process using the first photoresist pattern. A top metal line(30) is formed by stacking the metal material on the resultant structure. The second photoresist layer is stacked on the top metal line(30). A plurality of FA vias(36) are formed on an FA pad by etching the top metal line.
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