| 摘要 |
PURPOSE: A lead frame for a semiconductor package is provided to be capable of minimizing the breakage of the semiconductor package at the high temperature. CONSTITUTION: A lead frame for a semiconductor package includes a die paddle part(104) for loading a semiconductor chip(102). At this time, the die paddle part includes a plurality of slot holes(109). The lead frame further includes an inner lead part(106) electrically connected with the semiconductor chip and an outer lead part(108) for electrically connecting the semiconductor chip to the outside. Preferably, each slot hole has a quadrilateral type structure. Preferably, the quadrilateral is rhombus. Preferably, the edge portion of the quadrilateral type slot hole, is roundly formed. Preferably, the slot hole is located at a predetermined portion for preventing the contact of an adhesive coating needle.
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