| 摘要 |
PURPOSE: A substrate for a semiconductor chip package and a packaging method of a semiconductor device using the same are provided to be capable of simplifying manufacturing processes, improving electrical characteristics, and easily embodying a chip size package. CONSTITUTION: A substrate(300) for a semiconductor chip package is provided with a semiconductor chip attaching part(302) located at the center portion and a bond finger part(304) for being electrically connecting with a chip pad of a semiconductor chip. The substrate further includes an outer lead part(306) located at the peripheral portion and a trace part(308) for electrically connecting the bond finger part with the outer lead part. Preferably, a via hole(312) is formed at the center portion of the trace part.
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