| 摘要 |
PURPOSE: An LED and a method for forming a flip chip thereof are provided to reduce the thickness of the LED by mounting the LED chip on a PCB according to a flip chip method. CONSTITUTION: The first electrode port(31) and the second electrode port(33) are formed on an upper surface of a PCB(32) for processing a signal. A thin film paste having a size corresponding to a width of an entire area of an array of an LED chip(35) is formed on the first electrode port(31). The thin film paste having the constant thickness is formed on the second electrode port(33). The first electrode and the second electrode of the LED chip(35) and the thin film paste are aligned and attached each other. |
