| 摘要 |
<p>PURPOSE: A method for packaging semiconductor chips using an FBGA type is provided to reduce the thickness of a semiconductor chip package by improving an existing FBGA type package method. CONSTITUTION: A tape is adhered on the first side of a PCB(Printed Circuit Board)(102) having a window of a predetermined size for storing a semiconductor chip(202). The semiconductor chip(202) is adhered within the window of the PCB by using the tape. A wire bonding process and a molding process are performed on the semiconductor chip(202) and the second side of the PCB(102). The tape is removed from the first side of the PCB(102). A solder ball(602) is adhered on a predetermined position of the PCB(102). A cutting process for the PCB(102) is performed.</p> |
