发明名称 |
POLISHING SOLUTION SUPPLY APPARATUS |
摘要 |
PURPOSE: A polishing solution supply apparatus is provided to be capable of securing the uniformity of a CMP(Chemical Mechanical Polishing) process and improving the quality of a semiconductor product by automatically controlling the supply of the polishing solution. CONSTITUTION: A polishing solution supply apparatus is provided with a sensor(22) for detecting the flow of a polishing solution and a feedback system(27). The feedback system includes a converter(24) for transforming the signal generated from the sensor into a corresponding voltage, a PID controller(25) for carrying out a compensating process using a PID constant after comparing the voltage supplied from the converter with a reference value, and a motor driving part(26) for receiving a control signal of the PID controller. The polishing solution supply apparatus further includes a pump(21) for controlling the flow of the polishing solution according to the motor driving part.
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申请公布号 |
KR20040007020(A) |
申请公布日期 |
2004.01.24 |
申请号 |
KR20020041651 |
申请日期 |
2002.07.16 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
CHOI, GEUN MAN;KIM, SEON HWAN;MA, SEOK JUNG |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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