发明名称 POLISHING SOLUTION SUPPLY APPARATUS
摘要 PURPOSE: A polishing solution supply apparatus is provided to be capable of securing the uniformity of a CMP(Chemical Mechanical Polishing) process and improving the quality of a semiconductor product by automatically controlling the supply of the polishing solution. CONSTITUTION: A polishing solution supply apparatus is provided with a sensor(22) for detecting the flow of a polishing solution and a feedback system(27). The feedback system includes a converter(24) for transforming the signal generated from the sensor into a corresponding voltage, a PID controller(25) for carrying out a compensating process using a PID constant after comparing the voltage supplied from the converter with a reference value, and a motor driving part(26) for receiving a control signal of the PID controller. The polishing solution supply apparatus further includes a pump(21) for controlling the flow of the polishing solution according to the motor driving part.
申请公布号 KR20040007020(A) 申请公布日期 2004.01.24
申请号 KR20020041651 申请日期 2002.07.16
申请人 HYNIX SEMICONDUCTOR INC. 发明人 CHOI, GEUN MAN;KIM, SEON HWAN;MA, SEOK JUNG
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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