| 摘要 |
A metal frame for electronic hardware and a method of manufacturing such a frame wherein at least a portion of the frame is made of bulk-solidifying amorphous alloys or bulk-solidifying amorphous alloy-composites is provided. The metal frames of the invention are preferably made of bulk-forming amorphous alloys or bulk-forming amorphous alloy-composites having an elastic limit for the metal frame of at least about 1.5%, and preferably greater than about 2.0%, a DeltaTsc of more than 30° C., and at least one of the following properties: a hardness value of about 4 GPA or more, and preferably 5.5 GPA or more; a yield strength of about 2 GPa or more; a fracture toughness of about 10 ksi-sqrt(in) (sqrt:squre root) or more, and preferably 20 ksi sqrt(in) or more; and a density of at least 4.5 g/cc or more. |
