发明名称 Integrated circuit having a thermally shielded electric resistor trace
摘要 An integrated circuit includes an electric resistor trace, a substrate and a thermally conductive structure arranged above or below the electric resistor trace for dissipating heat from the electric resistor trace to the substrate. The present invention is based on the finding that by introducing the additional thermally conductive structure, despite the introduction of this additional thermally conductive structure requiring space at first, due to the significantly increased heat conductivity to the substrate, a smaller overall chip area for implementing integrated resistors can be obtained.
申请公布号 US2004011510(A1) 申请公布日期 2004.01.22
申请号 US20030424016 申请日期 2003.04.25
申请人 FISCHER ARMIN;HELNEDER JOHANN;KORNER HEINRICH;SCHWERD MARKUS;WALTER WOLFGANG;GLASOW ALEXANDER VON 发明人 FISCHER ARMIN;HELNEDER JOHANN;KORNER HEINRICH;SCHWERD MARKUS;WALTER WOLFGANG;GLASOW ALEXANDER VON
分类号 H01L27/08;(IPC1-7):F28F7/00 主分类号 H01L27/08
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