| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film carrier tape for mounting electronic components, wherein the wire bonding strength is high, fluctuation in strength is low, the bonding reliability is high, and the stability of the solder ball arranged on a ball pad is high. <P>SOLUTION: The film carrier tape for mounting electronic components in which a wiring pattern composed of a conductive metal is formed on the surface of an insulating film, is characterized in that a base layer essentially composed of nickel is formed at least on a part of the wiring pattern composed of the conductive metal, an intermediate layer essentially composed of palladium is formed on the surface of the base layer, and a surface layer essentially composed of gold is formed on the intermediate layer, and the average thickness of the intermediate layer essentially composed of palladium is 0.04 μm or smaller. <P>COPYRIGHT: (C)2004,JPO |
