发明名称 APPARATUS FOR MACHINING MATERIAL BY LASER BEAM
摘要 <p><P>PROBLEM TO BE SOLVED: To achieve with laser beam desired quality of a cut surface which is not substantially affected by direction of movement of the laser beam. <P>SOLUTION: This apparatus (1) machines a material by the laser beam (2). Light emitted from a laser is guided through at least one spherical optical element and this spherical optical element is arranged in an optical path of the laser beam (2), and a lens device (4) arranged tilted to an optical axis (5) is provided in the apparatus (1). Accordingly, the lens device (4) is eccentically arranged to the optical axis (5) in the apparatus which is configured to obtain a desired geometry of the laser beam to fall on a surface of the material. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004017067(A) 申请公布日期 2004.01.22
申请号 JP20020172992 申请日期 2002.06.13
申请人 LPKF LASER & ELECTRONICS AG 发明人 KUSNEZOW GENNADIJ
分类号 G02B26/10;B23K26/06;B23K26/073;B23K26/08;(IPC1-7):B23K26/06 主分类号 G02B26/10
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