发明名称 POWER MODULE
摘要 PROBLEM TO BE SOLVED: To solve the problem wherein electromagnetic shielding effect is deteriorated, since the distance between an electromagnetic shielding panel and a relay terminal is increased, when a breakdown voltage is secured between both of the members in a power module provided with a power semiconductor device is provided with the electromagnetic shielding panel for cutting-off electromagnetic noise produced during switching operation of the power semiconductor device. SOLUTION: By interposing an insulating material between the electromagnetic shielding panel and the relay terminal, the breakdown voltage force between both of the members become strong, and as a result, the distance between both the members can be reduced, so that the electromagnetic shielding effect is improved. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004022705(A) 申请公布日期 2004.01.22
申请号 JP20020173796 申请日期 2002.06.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 YOSHIMATSU NAOKI
分类号 H01L23/14;H01L25/07;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L23/14
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