发明名称 MOLD CLAMPING DEVICE AND MOLDING ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To realize the miniaturization and cost reduction of a mold clamping device. SOLUTION: The mold clamping device 5 is provided with a moving mechanism 16 for moving a pair of mold platens for holding a pair of molds, an energizing means 26 for imparting an energizing force to the moving mechanism 16 so as to clamp a pair of the molds by a prescribed force, and a transmission mechanism 27 for transmitting the energizing force of the energizing means 26 to the moving mechanism 16 and releasing the transmission of the force. Thus, since a pair of the molds are clamped by the energizing force of the energizing means 26, it is unnecessary to provide a hydraulic pressure, a servo motor or the like as a drive source for clamping a pair of the molds. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004017588(A) 申请公布日期 2004.01.22
申请号 JP20020178847 申请日期 2002.06.19
申请人 TAKARA SEISAKUSHO:KK 发明人 TAKAHASHI SHIGEO;FUJIWARA KOKI
分类号 B29C45/64;B29C33/20;B29C45/02;(IPC1-7):B29C45/64 主分类号 B29C45/64
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