| 发明名称 |
POLISHING PAD, MANUFACTURING METHOD THEREOF, POLISHING APPARATUS AND POLISHING METHOD FOR SEMICONDUCTOR SUBSTRATE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for polishing, which uses a polishing pad in which less dust sticks to the surface of an object to be polished, scratching is reduced, and a flattening characteristics is attained. <P>SOLUTION: The polishing method and the apparatus use the polishing pad having a foamed structure in which hydroscopic filler is dispersed in a polyurethane resin. <P>COPYRIGHT: (C)2004,JPO |
| 申请公布号 |
JP2004022632(A) |
申请公布日期 |
2004.01.22 |
| 申请号 |
JP20020172427 |
申请日期 |
2002.06.13 |
| 申请人 |
TORAY IND INC |
发明人 |
KOBAYASHI TSUTOMU;SHIMAGAKI MASAAKI |
| 分类号 |
B24B37/20;B24B37/24;C08J5/14;H01L21/304 |
主分类号 |
B24B37/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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