| 摘要 |
<P>PROBLEM TO BE SOLVED: To suck electronic components stably and effectively, when the electronic components are sucked simultaneously by using a plurality of suction nozzles. <P>SOLUTION: The electronic component mounting device 1, for sucking electronic components 81 to 83 from an electronic component supply part 4 with suction nozzles 31 to 33 provided to a head part 35, has a means 5 for detecting the position of a tip part of the suction nozzle fixed to the head part 35; a means 5 for detecting electronic component supply positions 41 to 43; a suctional range operation means 6 for obtaining suctioning ranges 41a to 43c of the suction nozzles 31 to 33; a reference position movement range operating means 6 for obtaining reference position movement ranges 91a to 93c of a reference position ○ of the head part 35; and a decision means 6. When it is decided that regions 90, 91, where the reference position suction ranges 91a to 93c mutually overlap exist in each of the nozzles 31 to 33, the head reference position ○ is moved to the inside of the region 90, wherein the reference position suction ranges are made to overlap and at the same time, the electronic components are sucked. <P>COPYRIGHT: (C)2004,JPO |
