Al-SiC COMPOSITE BODY, HEAT SINK COMPONENT USING THE SAME, AND SEMICONDUCTOR MODULE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an Al-SiC composite body which is capable of sufficiently dissipating heat released from an semiconductor chip outside without producing a gap between a heat sink component formed of the Al-SiC composite body and a support member, and to provide the heat sink component and a semiconductor module. SOLUTION: The main surface of the plate-like Al-SiC composite body where a semiconductor substrate is bonded and the other main surface of the composite body is each made to protrude in a convex shape as their centers are projecting from their ends, and the amount of projection is 150 to 500μm in length. After the semiconductor substrate is bonded to the Al-SiC composite body, the amount of projection of each of the main surface of the composite body where the semiconductor substrate is bonded and the other main surface becomes as long as 40 to 120μm. COPYRIGHT: (C)2004,JPO