| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a thick film circuit board which can reduce a cost while unevenness of a resistance value of a resistor is suppressed by assuring the resistance value of the resistor. SOLUTION: The method for manufacturing the thick film circuit board comprises the steps of first printing and drying a copper conductor paste on a ceramic board (step S1), then printing and drying a low resistance paste made of a two-element alloy containing a copper-nickel as a main component on the ceramic board (step S2), and thereafter holding the thick film circuit board in which the copper conductor paste and the low resistance paste are printed and dried in a nitrogen atmosphere of a temperature range of 600 to 700°C, and simultaneously baking the copper conductor paste and the low resistance paste (step S3). COPYRIGHT: (C)2004,JPO
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