| 摘要 |
PROBLEM TO BE SOLVED: To prevent the protrusion of an adhesive agent from a substrate and an adhesive failure from occurring, and to make the thickness of the adhesive agent, where conductivity and high heat dissipation are required, thinner, in a metal substrate formed by bonding a metal plate and a printed wiring board to each other using the adhesive agent. SOLUTION: First, an adhesive agent 2a is applied by printing to the metal plate 1, and further an adhesive agent 2b is applied to the printed wiring board 3. Here, the adhesive agent 2b is applied only to a part 6 of the printed wiring board 3 where a conductive pattern 4 is cut off by screen printing. The thickness of the applied adhesive agent 2b is made thicker than the height of the conductive pattern 4. A gap is formed between the conductive pattern 4 and the adhesive agent 2b. The metal plate 1 to which the adhesive agent 2a is applied and the printed wiring board 3 to which the adhesive agent 2b is applied are bonded to each other. COPYRIGHT: (C)2004,JPO
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