| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board for lead-free soldering, which shows excellent solderability to both reflow soldering with lead-free solder and reworking when the surface of a copper metal is soldered with the lead-free solder and, in addition, can make a used electroless-plated gold layer as thin as possible, and to provide a method soldering with the lead-free solder. SOLUTION: The flexible printed wiring board for lead-free soldering is constituted by successively forming an electroless-plated nickel-phosphorus layer containing phosphorus at a concentration of≤9.0 wt%, and the electroless-plated gold layer having a film thickness of 0.05-0.3μm in the terminal section of copper wiring. COPYRIGHT: (C)2004,JPO
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