| 摘要 |
A process for manufacturing a Printed Circuit Board (PCB) substrate with passive electrical components (e.g., capacitors, inductors and/or resistors) includes weaving a plurality of dielectric strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric. The woven fabric is impregnated with a dielectric resin material to form an impregnated fabric and, thereafter, the impregnated fabric is cured to form a cured fabric. The cured fabric's upper and lower surfaces are then planed. The planing of the upper and lower surface segments the electrically conductive strands and forms a PCB substrate with a passive electrical component (e.g., a capacitor and/or inductor) therein. The passive electrical component(s) includes electrically isolated conductive strand segments separated by at least one of the dielectric resin material and the dielectric strands. A PCB substrate with passive electrical components formed therein includes a planarized woven fabric with a cured dielectric resin material impregnated therein. The planarized woven fabric includes a planed upper surface, a planed lower surface and a plurality of integrally formed electrically conductive strand segments (e.g., copper wire segments) configured as electrically conductive portions of a passive electrical component. The cured dielectric resin material is disposed between the integrally formed conductive strand segments.
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