发明名称 DRY FILM RESIST AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a dry film resist which is a thin film and is excellent in tenting strength. <P>SOLUTION: A two-layer dry film resist 10 is formed of a first photoresist layer 14 which is made by applying on a supporting body 11 and drying, which reacts to an active ray and can be developed by alkali, a second photoresist layer 15 which is made by applying thereon in a state of water dispersion emulsion and drying, which reacts to an active energy ray and can be developed by alkali and a protective film which is laminated thereon. After the protective film is exfoliated, the dry film resist 10 has a through hole 18 and is laminated by a thermal roll on an insulating substrate 17 a surface of which is covered with plated copper. At that time, the second photoresist layer 15 enters in the through hole because of its large fluidity when heated. Further since the first photoresist layer 14 has small fluidity when heated, decrease of film thickness at an edge part of the through hole 18 is suppressed. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004020643(A) 申请公布日期 2004.01.22
申请号 JP20020171902 申请日期 2002.06.12
申请人 FUJI PHOTO FILM CO LTD 发明人 IWASAKI MASAYUKI
分类号 G03F7/004;G03F7/26;G03F7/40;H05K3/00;H05K3/06 主分类号 G03F7/004
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