| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for treating a substrate capable of controlling a pressure in a treating vessel by a rotating speed of a vacuum pump and capable of improving a through put of the treatment by reducing the time required for the whole substrate treatment. SOLUTION: The treatment is performed by continuously charging the substrate into the treating vessel 4 exhausted by the vacuum pump 8. The substrate is treated by keeping the treating vessel 4 in a first pressure by operating the vacuum pump 8 in a first rotating speed. After the completion of the treating process, the pressure in the treating vessel 4 is kept in a second pressure corresponding to a second rotating speed by changing the rotating speed of the vacuum pump 8 to a second rotating speed higher than the first rotating speed. After the inside of the treating vessel 4 becomes the second pressure, the replacement operation of the substrate in the treating vessel 4 is started. COPYRIGHT: (C)2004,JPO
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