| 发明名称 |
Semiconductor device and manufacturing method for the same, circuit board, and electronic device |
| 摘要 |
A semiconductor device has a substrate 11 on which a wiring pattern 14 is formed, a semiconductor die 20 mounted on the substrate 11, a sealed part 51 sealing the semiconductor die 20 on the substrate 11, and a heat sink 32 for the semiconductor die 20 supported above the substrate 11 by the sealed part 51. The heat sink is in electrical contact with the grounding line of semiconductor die 20.
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| 申请公布号 |
US2004012099(A1) |
申请公布日期 |
2004.01.22 |
| 申请号 |
US20030375866 |
申请日期 |
2003.02.26 |
| 申请人 |
NAKAYAMA TOSHINORI |
发明人 |
NAKAYAMA TOSHINORI |
| 分类号 |
H01L23/34;H01L21/56;H01L21/60;H01L21/603;H01L21/607;H01L21/68;H01L23/31;H01L23/36;H01L23/433;H01L23/49;H01L23/498;H01L23/552;(IPC1-7):B29C31/00;B28B11/12;H01L23/495 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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