发明名称 Device substrate and method for producing device substrate
摘要 A device substrate is provided having: a Si(111) substrate; a buffer layer formed by epitaxial growth on the Si(111) substrate 11, and containing at least one of a rare earth metal oxide and an alkali earth metal oxide; and a semiconductor material layer formed by epitaxial growth on the buffer layer, and containing at least one of a group II-VI semiconductor material having a wurtzite structure and a group III-V semiconductor material having a wurtzite structure. The buffer layer preferably comprises a hexagonal crystal structure oriented in the (001) plane or a cubic crystal structure oriented in the (111) plane, and the semiconductor material layer preferably comprises a hexagonal crystal structure oriented in the (001) plane.
申请公布号 US2004011280(A1) 申请公布日期 2004.01.22
申请号 US20030401288 申请日期 2003.03.27
申请人 HIGUCHI TAKAMITSU;IWASHITA SETSUYA;MIYAZAWA HIROMU 发明人 HIGUCHI TAKAMITSU;IWASHITA SETSUYA;MIYAZAWA HIROMU
分类号 H01L29/26;C30B23/02;H01L21/20;H01L21/205;(IPC1-7):C30B23/00;C30B25/00;C30B28/12;C30B28/14 主分类号 H01L29/26
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