发明名称 |
Device substrate and method for producing device substrate |
摘要 |
A device substrate is provided having: a Si(111) substrate; a buffer layer formed by epitaxial growth on the Si(111) substrate 11, and containing at least one of a rare earth metal oxide and an alkali earth metal oxide; and a semiconductor material layer formed by epitaxial growth on the buffer layer, and containing at least one of a group II-VI semiconductor material having a wurtzite structure and a group III-V semiconductor material having a wurtzite structure. The buffer layer preferably comprises a hexagonal crystal structure oriented in the (001) plane or a cubic crystal structure oriented in the (111) plane, and the semiconductor material layer preferably comprises a hexagonal crystal structure oriented in the (001) plane.
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申请公布号 |
US2004011280(A1) |
申请公布日期 |
2004.01.22 |
申请号 |
US20030401288 |
申请日期 |
2003.03.27 |
申请人 |
HIGUCHI TAKAMITSU;IWASHITA SETSUYA;MIYAZAWA HIROMU |
发明人 |
HIGUCHI TAKAMITSU;IWASHITA SETSUYA;MIYAZAWA HIROMU |
分类号 |
H01L29/26;C30B23/02;H01L21/20;H01L21/205;(IPC1-7):C30B23/00;C30B25/00;C30B28/12;C30B28/14 |
主分类号 |
H01L29/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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