发明名称 METHOD OF FABRICATING AN ALLOY FILM ON A FACE OF A HEAT EXCHANGER FOR AN INTEGRATED CIRCUIT
摘要 An alloy film is fabricated, on the face of a heat exchanger (11) for an integrated circuit, by a process that dispenses various liquids onto the heat exchanger's face. TO prevent those liquids from falling off of the heat exchanger's face onto other components which hold the heat exchanger on a frame, the process begins by combining the heat exchanger into an assembly that includes a retainer (12) and a compliant member (13). The retainer (12) catches any liquids that fall off the heat exchanger's face, and the compliant member (13) forms a seal between the heat exchanger and the retainer which prevents the liquids from leaking onto the other components.
申请公布号 WO03010815(A3) 申请公布日期 2004.01.22
申请号 WO2002US22832 申请日期 2002.07.17
申请人 UNISYS CORPORATION 发明人 MORANGE, BLANQUITA, ORTEGA
分类号 C23C2/00;H01L21/48;H01L23/473 主分类号 C23C2/00
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