| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a gold alloy wire for bonding a semiconductor element which is effective to prevent the wire from being disconnected even when the wire is connected at high temperatures and which has excellent roundness and uniformity of a diameter. <P>SOLUTION: The gold alloy wire for bonding the semiconductor element contains Sn of 1 to 50 mass ppm, Pt of 2 to 50 mass ppm, Y of 1 to 100 mass ppm, further arbitrarily one type or more selected from the group consisting of La, Ce, Eu, Gd, Mg and Ag of 1 to 100 mass ppm, and further arbitrarily at least one type selected from the group consisting of Be and Ca of 1 to 50 mass ppm, so that total sum of these added element is 6 to 150 mass ppm, and a residue is Au and unavoidable impurities. <P>COPYRIGHT: (C)2004,JPO |
