| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a package in a MID (molded interconnection device) structure optical detection/light-emitting device, wherein a light-emitting element and a light receiving element are mounted on two recessed portions of an insulating block. <P>SOLUTION: The bottom of each recessed portion of an insulating block is configured into a step shape to insulate wirings, and the lower electrode of an optical semiconductor device is connected to a wiring section provided on each lower stage through die bonding, and an upper electrode of the optical semiconductor device is connected with a wiring section provided on each upper stage through wire bonding. Further, the external sidewall of the insulating block is configured into a sloped structure, such that the distance between sidewalls in the direction of a mounting surface is reduced. <P>COPYRIGHT: (C)2004,JPO |
